? semiconductor components industries, llc, 2015 october, 2015 ? rev. 2 1 publication order number: NTSA4100/d NTSA4100, nrvtsa4100 low forward voltage, low leakage trench-based schottky rectifier features ? fine lithography t rench?based schottky technology for very low forward voltage and low leakage ? fast switching with exceptional temperature stability ? low power loss and lower operating temperature ? higher efficiency for achieving regulatory compliance ? high surge capability ? nrvtsa prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? switching power supplies including wireless, smartphone and notebook adapters ? high frequency and dc?dc converters ? freewheeling and or?ing diodes ? reverse battery protection ? instrumentation ? led lighting mechanical characteristics: ? case: epoxy, molded ? epoxy meets flammability rating ul 94?0 @ 0.125 in. ? lead finish: 100% matte sn (tin) ? lead and mounting surfacetemperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements device package shipping ? ordering information NTSA4100t3g sma (pb?free) 5000 / tape & reel schottky barrier rectifiers 4 amperes 100 volts www. onsemi.com sma case 403d style 1 marking diagrams ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. th41 ayww th41 = specific device code a = assembly location y = year ww = work week = pb?free package (note: microdot may be in either location) nrvtsa4100t3g sma (pb?free) 5000 / tape & reel
NTSA4100, nrvtsa4100 www. onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (t l = 118 c) i f(av) 4.0 a peak repetitive forward current, (square wave, 20 khz, t l = 110 c) i frm 8.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 50 a storage temperature range t stg ?65 to +150 c operating junction temperature t j ?55 to +150 c esd rating (human body model) 1b esd rating (machine model) m3 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. thermal characteristics characteristic symbol typ max unit thermal resistance, junction?to?lead, steady state (assumes 600 mm 2 1 oz. copper bond pad, on a fr4 board) r jl ? 16.2 c/w thermal resistance, junction?to?ambient, steady state (assumes 600 mm 2 1 oz. copper bond pad, on a fr4 board) r ja ? 90 c/w electrical characteristics instantaneous forward voltage (note 1) (i f = 1.0 a, t j = 25 c) (i f = 4.0 a, t j = 25 c) (i f = 1.0 a, t j = 125 c) (i f = 4.0 a, t j = 125 c) v f 0.43 0.59 0.35 0.53 ? 0.66 ? 0.58 v reverse current (note 1) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 125 c) i r 1.3 0.13 25 9 a ma diode capacitance (rated dc voltage, t j = 25 c, f = 1 mhz) c d 54.7 pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. pulse test: pulse width = 300 s, duty cycle 2.0%.
NTSA4100, nrvtsa4100 www. onsemi.com 3 typical characteristics figure 1. typical instantaneous forward characteristics figure 2. maximum instantaneous forward characteristics v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 1.0 0.8 0.6 0.4 0.2 0 0.1 1 10 100 0.8 0.6 0.2 0 0.1 1 10 100 figure 3. typical reverse characteristics figure 4. maximum reverse characteristics v r , instantaneous reverse voltage (v) v r , instantaneous reverse voltage (v) 90 70 60 50 40 30 20 10 100 80 70 50 30 20 10 figure 5. typical junction capacitance v r , reverse voltage (v) 0.1 10 100 1000 i f , instantaneous forward current (a) i r , instantaneous reverse current (a) c, junction capacitance (pf) i f , instantaneous forward current (a) 80 100 1.e?06 1.e?05 1.e?04 1.e?03 1.e?01 40 60 1.e?04 1.e?03 1.e?02 i r , instantaneous reverse current (a) 10 100 t a = 85 c t a = ?55 c t a = 25 c t a = 85 c t a = 125 c t a = ?55 c t a = 25 c t a = 125 c t a = 25 c figure 6. current derating t c , lead temperature ( c) 80 60 120 20 0 0 1 2 4 i f(av) , average forward current (a) 6 40 100 square wave dc r jl = 16.2 c/w t j = 25 c 0.4 90 t a = 125 c t a = 150 c t a = 85 c 1 1.0 t a = 125 c t a = 25 c t a = 150 c t a = 85 c 1.e?05 3 5 t a = 150 c t a = 150 c 1.2 1.e?07 1.e?02 1.e?01 1.e?06 140 7 8
NTSA4100, nrvtsa4100 www. onsemi.com 4 typical characteristics figure 7. forward power dissipation i f(av) , average forward current (a) 0 0 1 6 p f(av) , average forward power dissipation (w) 35 i pk /i av = 5 12 4 2 3 4 5 square wave i pk /i av = 10 dc i pk /i av = 20 7 8 0.001 0.01 0.1 1 10 1000 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 figure 8. typical transient thermal response, junction?to?ambient t, pulse time (s) r (t) , typical transient thermal resistance ( c/w) 50% duty cycle 20% 10% 5% 2% 1% 100 single pulse
NTSA4100, nrvtsa4100 www. onsemi.com 5 package dimensions sma case 403d?02 issue g dim a min nom max min millimeters 1.97 2.10 2.20 0.078 inches a1 0.05 0.10 0.20 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.083 0.087 0.004 0.008 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension b shall be measured within dimension l. polarity indicator optional as needed (see styles) 4.000 0.157 2.000 0.079 2.000 0.079 mm inches scale 8:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 NTSA4100/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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